Utilizing our polishing technology for high-hardness sapphire material, we do contract polishing and grinding of various materials, such as aluminum nitride ceramics, alumina ceramics, and zirconia ceramics. In addition, we can polish single crystals such as gallium nitride (GaN), aluminum nitride (AlN), zinc oxide (ZnO), gallium oxide (Ga2O3), and yttrium aluminum garnet (YAG). Please feel free to contact us with any request, as we can also process materials other than those listed. We also offer fine hole processing (drill/laser processing), bonding (atomic bonding), backside polishing, and full cutting (groove processing). For single-crystal materials, we support wafer processing, such as orientation flat processing and off-angle adjustment.
* We have a variety of other processes available; please contact us.
High Flatness Polishing Processing
|Peripheral blade cutting machine
|Inner peripheral blade cutting machine
|Wire cutting machine
|Double-side lapping machine
|Outer periphery grinding
|Depends on the processing (please contact us)
|Double-side lapping machine (Diamond/CMP)
|One side polishing machine
|Laser processing machine