Die Bonding / Wire Bonding
- Mounting process for Optical chip, Electronic component, MEMS chip.
- Die bonding by Ag paste, UV adhesive, solder etc…
Auto die bonder
Auto wire bonder
EX) Wire bonding for MEMS chip
Hermetic Seal (Packaging)
- Hermetic sealing by N2 gus.
- He leak test / Gross leak test equipment
- Vacuum baking (∼200°C)
Projection welding machine
EX) Packaging products (Window Glass)
Seam welding machine
