Our NAPHIA™ ceramic wafers are appropriate for semiconductor processes, thanks to the processing technology we have developed through our extensive experience with sapphire wafer polishing. We are able to process any material with minimal damage or grain boundary fractures on the wafer surface, and to a high degree of flatness.
Furthermore, we can do hole processing and cutting of ceramic wafers.
| Material | SiC (Poly crystal) | ||
|---|---|---|---|
| Polishing | CMP | Mechanical polishing | |
| Surface Roughness | Ra AFM | 0.45nm | 0.12nm |
| P-V AFM | 5.75nm | 0.97nm | |
| Shape | P-V(SORI) ※F.T | 1.73μm | 1.65μm |
※Flatness Tester
