We have drill and laser processing capability. Our NAPHIA™ through-hole sapphire wafers have high surface quality equivalent to that of bare sapphire wafers, and are suitable for semiconductor processing. We can make through-hole wafers not only from sapphire, but also from other materials (ceramics, silica glass, etc.).
|Example 1||Example 2||Typical value|
|Hole diameter [μm]||φ100μm||φ700μm||φ50μm～1000μm|
|Material diameter [mm]||φ150mm||φ80mm||～φ200mm|
|Material thickness [mm]||0.5mm||1mm||0.25～1mm|
|Number of holes||150 holes / wafer||600 holes/ wafer||-|