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Through-hole wafers
sapphire, AlN, SiC, etc.NAPHIA

Through-hole wafers

We have drill and laser processing capability. Our NAPHIA™ through-hole sapphire wafers have high surface quality equivalent to that of bare sapphire wafers, and are suitable for semiconductor processing. We can make through-hole wafers not only from sapphire, but also from other materials (ceramics, silica glass, etc.).

Example 1 Example 2 Typical value
Hole diameter [μm] φ100μm φ700μm φ50μm~1000μm
Material diameter [mm] φ150mm φ80mm ~φ200mm
Material thickness [mm] 0.5mm 1mm 0.25~1mm
TTV[μm] ≦10μm ≦2μm ≦10μm
Number of holes 150 holes / wafer 600 holes/ wafer -
Through-hole wafers

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