We have drill and laser processing capability. Our NAPHIA™ through-hole sapphire wafers have high surface quality equivalent to that of bare sapphire wafers, and are suitable for semiconductor processing. We can make through-hole wafers not only from sapphire, but also from other materials (ceramics, silica glass, etc.).
| Example 1 | Example 2 | Typical value | |
|---|---|---|---|
| Hole diameter [μm] | φ100μm | φ700μm | φ50μm～1000μm |
| Material diameter [mm] | φ150mm | φ80mm | ～φ200mm |
| Material thickness [mm] | 0.5mm | 1mm | 0.25～1mm |
| TTV[μm] | ≦10μm | ≦2μm | ≦10μm |
| Number of holes | 150 holes / wafer | 600 holes/ wafer | - |
