Orbray and MIRISE Technologies have begun collaborating on diamond power devices

Last Modified:2024/02/01 Published:2023/05/11 2023/05

Orbray Co., Ltd. (Tokyo; President and CEO Riyako Namiki; hereinafter referred to as "Orbray") and MIRISE Technologies Corporation (Aichi Prefecture; President Yoshifumi Kato; hereinafter referred to as "MIRISE Technologies") have begun collaborating on vertical diamond power devices^*1 that will contribute to carbon neutrality.

Over the three-year period of this project, Orbray and MIRISE Technologies will use their respective technologies, resources, and expertise in diamond substrates and power devices to develop the technologies needed to deploy vertical diamond power devices in a wide range of electric vehicles in the future.

In this research collaboration, Orbray will be responsible for developing a p-type conductive diamond substrate^*2, while MIRISE Technologies will take charge of developing a high-voltage operating device structure to demonstrate the feasibility of a vertical diamond power device. At the end of this project, the companies are planning to discuss the next stage of collaboration, such as further research and development.

As the automobile industry increasingly shifts to electric vehicles worldwide to achieve carbon neutrality, the development of next-generation automotive semiconductors is essential to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs. Compared with current mainstream semiconductor materials such as Si (silicon), SiC (silicon carbide), and GaN (gallium nitride), diamond is known as the "ultimate semiconductor material" because it has higher voltage operating capability and superior thermal conductivity (heat dissipation). In the future, the development and mass production of next-generation automotive semiconductors using diamond is expected to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs.

Orbray and MIRISE Technologies will leverage their respective strengths to develop next-generation in-vehicle semiconductors through vertical power devices, and thereby contribute to carbon neutrality.

^*1 Vertical diamond power device:
　A semiconductor device in which electric currents can flow through the diamond substrate.

^*2 p-type conductive diamond substrate:
　A p-type diamond substrate that is treated with certain substances to enable current to pass through.

Orbray Co., Ltd.
Head office: 3-8-22 Shinden Adachi-ku Tokyo,123-8511 Japan
Established: August 28, 1953.
Capital: 100 million yen.
Employees: 1000 (as of January 1, 2023).
Founded in 1939 with the manufacture of jewel bearings for electric meters.With jewel processing technology (cutting, grinding, and polishing) as its core technology, the company has continued to develop its leading-edge technology to create a variety of products. It currently manufactures and sells precision jewel parts, DC coreless motors, fiber optic components, and medical devices.
https://orbray.com/en

MIRISE Technologies Corporation
Head office: 500-1, Minamiyama, Komenoki-cho, Nisshin-shi, 470-111 Aichi
Established: April 1, 2020.
Capital: 50 million yen.
Employees: Approx. 530 (as of January 1, 2023).
A research company on automotive semiconductors established in 2020 with a joint investment by DENSO and Toyota. By combining Toyota's years of mobility-focused expertise and DENSO's long history of in-vehicle-focused expertise, MIRISE Technologies is working toward the early development of the next generation of in-vehicle semiconductors. These semiconductors will be the key to technological innovation in electric vehicles and self-driving vehicles, from both a car and a component perspective.
https://www.mirise-techs.com/en

For inquiries:

Orbray Co., Ltd. Public relations department
TEL: +81-3-3919-0101　

MIRISE Technologies Corporation
https://www.mirise-techs.com/contact/

Related Articles: